A report on the Joint Workshop of the NMBP-35 projects has been published

We are pleased to announce that a report on the recent joint workshop of the NMBP-35 projects (nanoMECommons, Charisma, and EASY-STRESS) has now been published on the Zenodo platform.

The workshop was held in Madrid on Wednesday 17 January, 2024, and was supported by the European Materials Characterisation Council (EMCC). To read this report, follow this link.

 

EMCC on LinkedIn

The European Materials Characterisation Council (EMCC), is now on LinkedIn. You can see their posts, following  this link.

NanoMECommons at the EuroNanoForum 2023- Sweden -13 June 2023

NanoMECommons will be represented at the EuroNanoForum 2023, taking place in Sweden on the 13 June 2023. Partners NTUA, UNIROMA3, IRES, SINTEF, GCL, ESRF, CNAT are the organising committee of the EMCC session. For more information, please visit the European Materials Characterisation Council (EMCC) website following this link.

NanoMECommons at the 4th EMMC International Workshop – 26-28 April 2023

The NanoMECommons project will be represented at the 4th International Workshop organised by EMMC on 26-28th April, in Vienna, Austria. The Project Coordinator, Prof. Costas Charitidis (NTUA), will be chairing the Modelling and Characterisation Session, on the second day. For more information on this event, please follow this link.

nanoMECommons – Open Day Workshop – Registration Open

Registration to participate in the nanoMECommons Open Day Workshop is OPEN! This event is being hosted by the project partner, Ansys, in Cambridge, UK, on the 3-4 July 2023. For more information, please visit the Open Day dedicated page, following this link.

nanoMECommons – Open Day Workshop – SAVE THE DATE 3-4 July 2023

The NanoMECommons Project is pleased to announce its 1st Exploitation and Dissemination Open Day Workshop, taking place on the 3 & 4 July 2023. The hybrid meeting will be hosted at the offices of Ansys UK Ltd ( 62 Clifton Road, Cambridge, CB1 7EG, UK) in Cambridge, UK. Please SAVE THESE DATES in your diaries! More information on the venue, agenda and registration form will be available soon.

NanoMECommons will participate at the Euromat Conference 2023 – 3-7 September

NanoMECommons partner, Ansys Inc., will represent the project at the EUROMAT 2023 Conference, taking place on the 3-7 September 2023. This will be a hybrid meeting held in Frankfurt, Germany.

Ansys will give a presentation entitled: Building the nanoMECommons Database: a workflow for indentation data digitalisation to numerical simulations. This will be presented in the section Symposium D08: Digital Materials: Experiments, Simulation Workflows, Ontologies and Interoperability (Characterization and Modelling Area).

Evaluation of NanoMECommons Innovations from Innovation Radar has been published

The NanoMECommons project has been evaluated by experts for the Innovation Radar, regarding the innovations in the project and its market potential. More information on the results can be seen on this link.
The Innovation Radar is a European Commission initiative to identify high potential innovations and innovators in EU-funded research and innovation projects.

M24 Progress Meeting – Rome, Italy -25 -26 January 2023

The nanoMECommons M24 Progress meeting was hosted at the Department of Engineering by the University “Roma Tre” (Rome, Italy). At this in-person two-day meeting, partners presented their good progress during this 24 months and future plans.

 

Participation at the FOMI22 – 12-15 September 2022

NanoMECommons will be represented by the partner Goldbeck Consulting Ltd, who will present at 12th International Workshop on Formal Ontologies meet Industry (FOMI22), 12-15 Sept 2022, Tarbes (France): https://ontocommons.eu/news-events/events/12th-international-workshop-formal-ontologies-meet-industry-fomi22 The paper to be presented is titled: The CHAMEO ontology: exploiting EMMO’s multiperspective versatility for capturing materials characterization procedures. Authors: Pierluigi Del Nostro, Gerhard Goldbeck and Daniele Toti.